IEC 60286-3:2013

IEC 60286-3


®


Edition 5.0 2013-05



INTERNATIONAL



STANDARD



NORME
INTERNATIONALE


Packaging of components for automatic handling –
Part 3: Packaging of surface mount components on continuous tapes

Emballage de composants pour opérations automatisées –
Partie 3: Emballage des composants pour montage en surface en bandes
continues


IEC 60286-3:2013

---------------------- Page: 1 ----------------------
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IEC 60286-3



®



Edition 5.0 2013-05







INTERNATIONAL





STANDARD







NORME



INTERNATIONALE











Packaging of components for automatic handling –

Part 3: Packaging of surface mount components on continuous tapes




Emballage de composants pour opérations automatisées –

Partie 3: Emballage des composants pour montage en surface en bandes

continues
















INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE

PRICE CODE
INTERNATIONALE

CODE PRIX W


ICS 31.020; 31.240 ISBN 978-2-83220-819-9



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

---------------------- Page: 3 ----------------------
– 2 – 60286-3 © IEC:2013


CONTENTS



FOREWORD . 5

INTRODUCTION . 7

1 General . 8


1.1 Scope . 8

1.2 Normative references . 8

2 Terms and definitions . 8

3 Structure of the specification . 10

4 Dimensional requirements for taping. 10
4.1 Component cavity positioning requirements . 10
4.1.1 Requirements for types 1a, 1b, 2a, 2b and 3. 10
4.1.2 Requirements for types 4 . 10
4.2 Component cavity dimension requirements (tape types 1a, 1b, 2a, 2b and 3) . 11
4.3 Type 1a – Punched carrier tape, with top and bottom cover tape (tape widths:
8 mm and 12 mm) . 12
4.4 Type 1b – Pressed carrier tape, with top cover tape (tape width: 8 mm) . 14
4.5 Type2a – Blister carrier tape, with single round sprocket holes and tape
pitches down to 2 mm (tape widths: 8 mm, 12 mm, 16 mm and 24 mm) . 16
4.6 Type 2b – Blister carrier tape, with single round sprocket holes and with

1mm tape pitch (tape widths: 4 mm) . 18
4.7 Type 3 – Blister carrier tape, with double sprocket holes (32 mm to 200 mm) . 20
4.8 Type 4 – Adhesive-backed punched plastic carrier tape for singulated bare
die and other surface mount components (8 mm, 12 mm, 16 mm and 24 mm) . 22
5 Polarity and orientation requirements of components in the tape . 25
5.1 Requirements for all tape types . 25
5.2 Specific requirements for type 1a . 25
5.3 Specific requirements for type 4 . 25
6 Carrier tape requirements . 25
6.1 Taping materials . 25
6.2 Minimum bending radius (for all types) . 26
6.3 Camber . 26
7 Cover tape requirements (for type 1a, 1b, 2a, 2b and 3) . 27
8 Component taping and additional tape requirements . 28

8.1 All types . 28
8.2 Specific requirements for type 1b . 28
8.3 Specific tape requirements for type 2b. 28
8.4 Specific requirement for type 4 . 28
8.4.1 General . 28
8.4.2 Coordinate system . 29
8.4.3 Component positioning and lateral displacement (see Figures 19 and 23) . 30
8.5 Specific requirements for tapes containing die products . 31
8.5.1 General . 31
8.5.2 Tape design for tapes containing die products . 31
8.5.3 Cleanliness . 31
8.5.4 Die lateral movement (Types 1a, 2a and 2b) . 32
9 Reel requirements . 32
9.1.1 General . 32

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60286-3 © IEC:2013 – 3 –


9.1.2 Reel dimensions related to tape (see Figure 24 and Table 23) . 32

9.1.3 Reel hole dimensions (see Figure 25 and Table 24) . 34

9.2 Marking . 34

10 Tape reeling requirements . 35

10.1 All types . 35

10.2 Specific requirements for type 1a . 35

10.3 Specific requirements for type 4 . 35

10.4 Leader and trailer tape (see Figure 27) . 36

10.4.1 Leader . 36

10.4.2 Trailer . 36
10.5 Recycling . 36
10.6 Missing components . 36
Annex A (normative) Recommended measuring methods for type 1b . 37
Bibliography . 39

Figure 1 – Sectional view of component cavity (type 1b) . 9
Figure 2 – 8 mm and 12 mm punched carrier-tape dimensions (4 mm cavity pitch) . 12
Figure 3 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset . 12
Figure 4 – Maximum component tilt, rotation and lateral movement . 12
Figure 5 – Dimensions (P = 4 mm/P = 2 mm) and (P = 4 mm/P = 1 mm) . 14
0 1 0 1
Figure 6 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset . 14
Figure 7 – Maximum component tilt, rotation and lateral movement . 14
Figure 8 – Blister carrier tape dimensions (8 mm, 12 mm, 16 mm and 24 mm) . 16
Figure 9 – Illustration of 2 mm cavity pitch and pocket offset . 16
Figure 10 – Maximum component tilt, rotation and lateral movement . 16
Figure 11 – Type 2b carrier tape . 18
Figure 12 – Maximum pocket offset . 18
Figure 13 – Maximum component tilt, rotation and lateral movement . 18
Figure 14 – Blister carrier tape . 20
Figure 15 – Elongated sprocket hole skew . 20
Figure 16 – Maximum component tilt, rotation and lateral movement . 20
Figure 17 – Adhesive-backed punched carrier-tape dimensions (4 mm compartment
pitch) . 23
Figure 18 – Illustration of 2 mm compartment pitch . 23
Figure 19 – Maximum component planar rotation and lateral displacement . 23
Figure 20 – Bending radius . 26
Figure 21 – Camber (top view) . 27
Figure 22 – Type 4 coordinate system . 30
Figure 23 – Component clearance and positioning method . 31
Figure 24 – Reel . 32
Figure 25 – Reel hole presentation . 34
Figure 26 – Tape reeling and label area on the reel . 35
Figure 27 – Leader and trailer . 36
Figure A.1 – Carrier tape thickness measurement points . 37

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– 4 – 60286-3 © IEC:2013


Figure A.2 – Cavity cross-section . 37

Figure A.3 – Cavity depth dimension . 38




Table 1 – component size codes . 9

Table 2 – Constant dimensions of 8 mm and 12 mm punched carrier tape . 13


Table 3 – Variable dimensions of 8 mm and 12 mm punched carrier tape . 13

Table 4 – Component tilt, planar rotation and lateral movement . 13

Table 5 – Constant dimensions of 8 mm pressed carrier tape . 15


Table 6 – Variable dimensions of 8 mm pressed carrier tape . 15
Table 7 – Component tilt, planar rotation and lateral movement . 15
Table 8 – Constant dimensions of 8 mm to 24 mm blister carrier tape . 17
Table 9 – Variable dimensions of 8 mm to 24 mm blister carrier tape . 17
Table 10 – Component tilt, rotation and lateral movement . 17
Table 11 – Constant dimensions of 4 mm carrier tape . 19
Table 12 – Variable dimensions of 4 mm carrier tape . 19
Table 13 – Component tilt, planar rotation and lateral movements . 19
Table 14 – Constant dimensions of 32 mm to 200 mm blister carrier tape . 21
Table 15 – Variable dimensions of 32 mm to 200 mm blister carrier tape . 21
Table 16 – Component tilt, planar rotation and lateral movements . 21
Table 17 – Dimensions of adhesive backed punched carrier tape . 24
Table 18 – Variable dimensions of adhesive-backed punched carrier tape . 24
Table 19 – Component planar rotation and lateral displacement . 24
Table 20 – Minimum bending radius . 26
Table 21 – Peel force . 27
Table 22 – Absolute referencing data for component target position . 30
Table 23 – Reel dimensions . 33
Table 24 – Reel hole dimensions . 34

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60286-3 © IEC:2013 – 5 –


INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________



PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –



Part 3: Packaging of surface mount components

on continuous tapes





FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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6) All users should ensure that they have the latest edition of this publication.
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 60286-3 has been prepared by IEC technical committee 40:
Capacitors and resistors for electronic equipment.
This fifth edition cancels and replaces the fourth edition, published in 2007, as well as
IEC 60286-3-1, published in 2009 and IEC 60286-3-2, published in 2009. It constitutes a full
layout revision. In addition, this edition includes the following significant technical changes
with respect to the previous edition:
a) integration of IEC 60286-3-1:2009 as type 1b (Packaging of surface mount components on
continuous pressed carrier tapes);
b) integration of IEC 60286-3-2:2009 as type 2b (Packaging of surface mount components on
blister carrier tapes 4 mm in width).

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– 6 – 60286-3 © IEC:2013


The text of this standard is based on the following documents:


FDIS Report on voting

40/2200/FDIS 40/2233/RVD



Full information on the voting for the approval of this standard can be found in the report on

voting indicated in the above table.


This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

The list of all the parts of the IEC 60286 series, under the general title Packaging of
components for automatic handling, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

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60286-3 © IEC:2013 – 7 –


INTRODUCTION


Tape packaging meets the requirements of automatic component placement machines and

also covers the use of tape packaging for components and singulated dies for test purposes

and other operations.

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– 8 – 60286-3 © IEC:2013


PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –



Part 3: Packaging of surface mount components

on continuous tapes








1 General


1.1 Scope
This part of IEC 60286 is applicable to the tape packaging of electronic components without
leads or with lead stumps, intended to be connected to electronic circuits. It includes only
those dimensions that are essential for the taping of components intended for the above-
mentioned purposes.
This standard also includes requirements related to the packaging of singulated die products
including bare die and bumped die (flip chips).
1.2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60191-2, Mechanical standardization of semiconductor devices – Part 2: Dimensions
IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirements
IEC/TR 61340-5-2, Electrostatics – Part 5-2: Protection of electronic devices from
electrostatic phenomena – User guide
2 Terms and definitions
For the purposes of this document, the following terms and definitions apply. Definitions apply
to all tape types, unless specifically mentioned.

2.1
components
unless specifically mentioned otherwise, for all packaging types for bare die products, the
term components refers to components as well as singulated die products
2.2
component sizes
all component sizes are identified with their metric size code (size code, followed by a
capital M)
Note 1 to entry: To avoid possible confusion with inch-based size codes, an equivalent table is shown in Table 1.

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60286-3 © IEC:2013 – 9 –


Table 1 – component size codes


Metric size code Inch size code

0402M 01005


0603M 0201


1005M 0402

1608M 0603


2012M 0805


2.3
packaging
product made of any material of any nature to be used for the containment, protection,
structured alignment for automatic assembly, handling and delivery
2.4
pressed carrier tape
(type 1b) carrier tape with concave cavities formed by compression of the base material
2.5
fluff
(type 1b) fibre from the base material attached inside the cavity
SEE: Figure 1.
2.6
burr
(type 1b) surface projection of tape unintentially produced when cavity is formed
SEE: Figure 1.
2.7
deformation
(type 1b) bulge on the inner wall of the cavity
SEE: Figure 1.
2.8
puff

(type 1b) bulge on the reverse side of the cavity
SEE: Figure 1.

Burr
Fluff
Deformation
Puff
IEC  1209/13

Figure 1 – Sectional view of component cavity (type 1b)

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– 10 – 60286-3 © IEC:2013




2.9

blister carrier tape

tape types 2a, 2b and 3 are identified as blister carrier tapes


Note 1 to entry: These types of carriers are also known as ‘embossed’ carrier types.


3 Structure of the specification


The various types of tapes are as follows.

NOTE 1 The separation of the prior type 1 into two sub-types 1a and 1b is new in this edition of this standard.
Any reference to type 1 not being specific to type 1a or type 1b is considered as referring to type 1a.
Type 1 – Punched and pressed carrier tape
Type 1a: Punched carrier tape, with top and bottom cover tape (tape
widths: 8 mm and 12 mm)
Type 1b: Pressed carrier tape, with top cover tape (tape width: 8 mm)
NOTE 2 The separation of the prior type 2 into two sub-types 2a and 2b is new in this edition of this standard.
Any reference to type 2 not being specific to type 2a or type 2b is considered as referring to type 2a.
Type 2 – Blister carrier tape, with single round sprocket holes
Type 2a: Blister carrier tape, with single round sprocket holes, with top
cover tape and tape pitches down to 2 mm (tape widths: 8 mm,
12 mm, 16 mm and 24 mm)
Type 2b: Blister carrier tape, with single round sprocket holes, with top
cover tape and with 1mm tape pitch (tape widths: 4 mm)
Type 3 – Blister carrier tape, with double sprocket holes (tape widths: 32 mm to
200 mm)
Type 4 – Adhesive-backed punched plastic carrier tape for singulated bare die and
other surface mount components (tape widths: 8 mm, 12 mm, 16 mm, and
24 mm)

4 Dimensional requirements for taping
4.1 Component cavity positioning requirements
4.1.1 Requirements for types 1a, 1b, 2a, 2b and 3
For defined component positioning, the cavity shall be defined to an origin point. The origin is
the centre of the round sprocket hole, defined by the crosshair of the dimensions E and P .
1 0
The centre of the compartment shall be defined by P and F, relative to the round sprocket
2
hole. When dimension P is smaller or equal to 2 mm, the maximum allowed pocket offset,
1
relative to the centre of the round sprocket hole, shall be applied.
4.1.2 Requirements for types 4
For defined component positi
...