MT 60286-3 - TC 40/MT 60286-3

IEC 60286-3:2022 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This edition includes the following significant technical changes with respect to the previous edition:  
addition terms and definitions.
addition of a table of the classification to symbols concerning drive hole diameter and distance between the reel hole centre and the drive hole centre;
addition of drive hole to the reel (optional);
revision of reel hole diameter tolerances;
revision of 72 mm tape size carrier tape width dimension tolerances;
addition of Annex B (informative);
addition of component size 0201M.

IEC 60286-3:2019 is available as IEC 60286-3:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60286-3:2019 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This edition includes the following significant technical changes with respect to the previous edition:
- addition of a table of the classification to symbols concerning tape, reel and common symbols;
- additions of a figure of example of polarity and orientation and a figure of example of dot seal;
- revision of requirements for camber;
- addition of a definition of design value with regard to tilt.

IEC 60286-3:2013 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This fifth edition cancels and replaces the fourth edition, published in 2007, as well as IEC 60286-3-1, published in 2009 and IEC 60286-3-2, published in 2009. It constitutes a full layout revision. In addition, this edition includes the following significant technical changes with respect to the previous edition:
a) integration of IEC 60286-3-1:2009 as type 1b (Packaging of surface mount components on continuous pressed carrier tapes);
b) integration of IEC 60286-3-2:2009 as type 2b (Packaging of surface mount components on blister carrier tapes 4 mm in width).