Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines

IEC TR 61189-3-914:2017(E) specifies the detailed procedures and precautions for IEC 61189-3-913.

General Information

Status
Published
Publication Date
16-Mar-2017
Drafting Committee
Current Stage
PPUB - Publication issued
Start Date
03-Apr-2017
Completion Date
17-Mar-2017
Ref Project

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IEC TR 61189-3-914:2017 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines
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IEC TR 61189-3-914
®

Edition 1.0 2017-03
TECHNICAL
REPORT

colour
inside


Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 3-914: Test method for thermal conductivity of printed circuit boards for
high-brightness LEDs – Guidelines

IEC TR 61189-3-914:2017-03(en)

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IEC TR 61189-3-914

®


Edition 1.0 2017-03




TECHNICAL



REPORT








colour

inside










Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –

Part 3-914: Test method for thermal conductivity of printed circuit boards for


high-brightness LEDs – Guidelines
























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ELECTROTECHNICAL


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ICS 31.180 ISBN 978-2-8322-4110-3



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® Registered trademark of the International Electrotechnical Commission

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– 2 – IEC TR 61189-3-914:2017 © IEC 2017
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 Test condition . 7
4.1 Standard condition . 7
4.2 Specified condition .
...

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