IEC 61190-1-3:2007/AMD1:2010

IEC 61190-1-3

®

Edition 2.0 2010-06



INTERNATIONAL



STANDARD



NORME
INTERNATIONALE
AMENDMENT 1
AMENDEMENT 1
Attachment materials for electronic assembly –
Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-
fluxed solid solders for electronic soldering applications

Matériaux de fixation pour les assemblages électroniques –
Partie 1-3: Exigences relatives aux alliages à braser de catégorie électronique et
brasures solides fluxées et non fluxées pour les applications de brasage
électronique


IEC 61190-1-3:2007/A1:2010

---------------------- Page: 1 ----------------------
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---------------------- Page: 2 ----------------------
IEC 61190-1-3


®

Edition 2.0 2010-06



INTERNATIONAL



STANDARD



NORME
INTERNATIONALE
AMENDMENT 1
AMENDEMENT 1
Attachment materials for electronic assembly –
Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-
fluxed solid solders for electronic soldering applications

Matériaux de fixation pour les assemblages électroniques –
Partie 1-3: Exigences relatives aux alliages à braser de catégorie électronique et
brasures solides fluxées et non fluxées pour les applications de brasage
électronique


INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
J
CODE PRIX
ICS 31.190 ISBN 978-2-88910-975-3
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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– 2 – 61190-1-3 Amend.1 © IEC:2010



FOREWORD


This amendment has been prepared by IEC technical committee 91: Electronics assembly

technology


The text of this amendment is based on the following documents:


FDIS Report on voting

91/920/FDIS 91/925/RVD


Full information on the voting for the approval of this amendment can be found in the report
on voting indicated in the above table.
The committee has decided that the contents of this amendment and the base publication will
remain unchanged until the stability date indicated on the IEC web site under
"http://webstore.iec.ch" in the data related to the specific publication. At this date, the
publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
_____________
Delete in the foreword the totality of the existing patent statements.
Add the following new page INTRODUCTION with the following text
INTRODUCTION
Attention is drawn to the possibility that some of the elements of this document may be the
subject of patent rights. IEC shall not be held responsible for identifying any or all such patent
rights.
The International Electrotechnical Commission (IEC) draws attention to the fact that it is
claimed that compliance with this document may involve the use of a patent concerning in
particular alloys compositions.

IEC takes no position concerning the evidence, validity and scope of this patent right.
The holder of this patent right has assured the IEC that he/she is willing to negotiate licences
under reasonable and non-discriminatory terms and conditions with applicants throughout the
world. In this respect, the statement of the holder of this patent right is registered with IEC.
Information may be obtained from:
US PAT No. 4879096
Cookson Electronics Assembly Materials
600 Route 440 Jersey City,New Jersey 07304

US PAT No. 5527628
Iowa State University Research Foundation, Inc.
310 Lab of Mechanics
Ames, Iowa 50011-2131, U.S.A.

JP PAT No. 3040929
JP PAT No. 3027441
Matsushita Electric Industrial Co., Ltd.
Matsushita IMP Building 20F 1-3-7, Shiromi, Chouh-ku, Osaka, 540-6319, Japan

---------------------- Page: 4 ----------------------
61190-1-3 Amend.1 © IEC:2010 – 3 –




JP PAT No. 2805595
Mitsui Mining & Smelting Co., Ltd.

Gate City Ohsaki-West Tower 19th Fl. 1-11-1 Osaki, Shinagawa-ku, Tokyo, 141-8584, Japan



JP PAT No. 3027441
Senju Metal Industry Co., Ltd.

Senju Hashido-cho 23, Adachi-ku, Tokyo, 120-8555, Japan



NOTE Patent rights vary between country of manufacture, sale, use and final destination; suppliers or users

remain responsible for establishing the exact legal position relevant to their own situation.

Attention is drawn to the possibility that some of the elements of this document may be the

subject of patent rights other than those identified above. IEC shall not be held responsible for

identifying any or all such patent rights.
2 Normative references
Remove the existing reference ISO 9453 and replace it by the following new reference:
ISO 9453:2006, Soft solders alloys – Chemical compositions and forms
4.1 Alloy composition
Add the following note at the end of this subclause:
N0TE The alloy short name can be used as identifier of solder alloy(s) in mounted boards used in electrical and
electronic equipment (see Annex C).
Table B.1 – Composition, and temperature characteristics of lead-free solder alloys
Replace the entire Table B.1 by the following new Table B.1:

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– 4 – 61190-1-3 Amend.1 © IEC:2010


a, b
1
Table B.1 – Composition, and temperature characteristics of lead-free solder alloys

Other
Alloy Short Sn Cu Bi In Ag Sb Temperature

d
component
name name °C
    elements
% % % % % %
Solidus Liquidus


c
Sn100 Sn100 99,9    232 mp

Sn97Ag3 A30 REM-97,0  3  221 224

Sn95A g5 A50 REM-95,0  5  221 240

ea
Sn96,5Ag3,5 A35 REM-96,5  3,5  221

Sn96,3Ag3,7 A37 REM-96,3  3,7  221 228
Sn99Cu,7Ag,3 C7A3 REM-99,0 0,7 – – 0,3±0,10 – – 217 227
Sn98.97Cu,7Ag,3Ni,03 C7A3Ni REM-98,97 0,7 – – 0,3±0,10 – Ni0.03±0.01 218 228
Sn98.3Cu,7Ag1 C7A10 REM-98,7 0,7 – – 1,0 – 217 224
Sn95Cu4Ag1 C40A10 REM-95,0 4,0±0,50– – 1,0 – – 217 353
Sn92Cu6Ag2 C60A20 REM-92,0 6,0 – – 2,0 – – 217 380

Sn96,5Ag3Cu,5 A30C5 REM-96,5 0,5 – – 3,0 – – 217 220

Sn95,8Ag3,5Cu,7 A35C7 REM-95,8 0,7 – – 3,5 – – 217 218

Sn95,5Ag3,8Cu,7 A38C7 REM-95,5 0,7  3,8  217 226

Sn95,5Ag4,0Cu,5 A40C5 REM–95,5 0,5 – – 4,0 – – 217 229

Sn96Ag2,5Bi1Cu,5 A25B10C5 REM-96,0 0,5 1,0 2,5  213 218
Sn42Bi58 B580 REM-42,0 – 58,0 – – – – 139 ea
ea
Sn99,3Cu,7 C7 REM-99,3 0,7 – – – – – 227
Sn97Cu3 C30 REM-97,0 3,0 – – – – – 227 310
Sn48In52 N520 REM-48,0 – – 52 – – – 118 ea

Sn88In8Ag3,5Bi,5 N80A35B5 REM-88,0 – 0,5 8,0 3,5 – – 196 206

Sn92In4Ag3,5Bi,5 N40A35B5REM-92,0 – 0,5 4,0 3,5 – – 210 216
Sn95Sb5 S50 REM-95,0   5,0±0,50 235 240
ea
Sn91Zn9 Z90 REM-91,0 – – – – – Zn9,0 199
Sn89Zn8Bi3 Z80B30 REM-89,0 – 3,0 – – – Zn8,0 190 197
a
Except where otherwise indicated, the component elements in each alloy should not vary from their tabulated percentage by more
than the following,
If ≤5 % of total alloy variation equals ±0,2 %,

If >5 % of total alloy variation equals ±0,5 %,
The letters "REM" appearing with a NUMBER for an element of an alloy (e.g. REM-10,0) denotes that the element makes up the
REMAINDER of that alloy with its actual percentage calculated as a difference from 100 %, the NUMBER indicates the
approximate percentage of that element in the alloy.
b
The solidus and liquidus temperature values are provided for information only and are not intended to be a requirement in the
formulation of the alloys. In the “Liquidus” column, “ea” indicates eutectic alloys and “mp” indicates the tabulated solidus
temperature representing the melting point for the elements (Sn100). Although efforts have been made to document the correct
solidus and liquidus temperatures for each alloy, users of this standard are advised to verify these temperature values before use.
c
Alloy Sn100 is included in this document for use in replenishing tin in wave soldering baths and is not suitable for use as a stand-
alone solder because of potential tin pest problems. Do not use alloy Sn100 as a stand-alone solder on hardware being fabricated
for a government unless it is specifically identified for such use in a government-approved end item drawing, specification, or
waiver.
d
Short name definitions for lead-free alloys.
___________
1
For footnotes to Table B.1, see the following page

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61190-1-3 Amend.1 © IEC:2010 – 5 –


Other
Alloy Short Sn Cu Bi In Ag Sb Temperature

d
component
name name °C
   elements

% % % % % % Solidus Liquidus


For labelling purposes, in cases of limited space, a short name code is available for use according to the guidelines below:


The key alloying elements are identified using one letter as follows:

A silver
B bismuth
C copper

N indium

S antimony
Z zinc

Ni nickel
The short name does not indicate the base element (i.e. tin) in lead-free alloys as this is assumed.
Digits are used to indicate percentage of key elements as follows:
x = 0,x % (for example 5 corresponds to 0,5 % by weight)
xx = x,x % (for example 55 corresponds to 5,5 % by weight)
xxx = xx,x %        (for example 505 corresponds to 50,5 % by weight)
No digits for <0,1%    (for example Ni corresponds to Ni0.0X % by weight)

For example, Sn98.97Cu,7Ag,3Ni0.03 has short name C7A3Ni.

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– 6 – 61190-1-3 Amend.1 © IEC:2010


Replace the text of Table B.4 by the following new Table B.4:


Table B.4 – Cross reference from solidus and liquidus temperatures
a
2
to alloy names by temperature

Temperature

Alloy
°C
name

Solidus Liquidus

96 ea Sn16Pb32Bi52

100 ea Sn34Pb20Bi46

118 ea In52Sn48

120 167 Sn46Pb46Bi08
134 181 In26Sn38Pb37
138 ea Sn42Bi58
140 160 Sn30Cd70
144 163 Sn43Pb43Bi14
145 ea Sn50Pb32Cd18
149 150 In80Pb15Ag05
153 163 In12Sn70Pb18
156 mp In100
160 174 In70Pb30
174 185 In60Pb40
178 270 Sn18Pb80Ag02
179 ea Sn62Pb36Ag02Sb4
179 ea Sn62Pb36Ag02
180 185 Sn60Pb38Bi02
180 209 In50Pb50
183 ea Sn63Pb37
183 ea Sn63Pb37Sb4
183 190 Sn60Pb38Cu02
183 191 Sn60Pb40
183 191 Sn60Pb40Sb4
183 193 Sn70Pb30
183 193 Sn70Pb30Sb4
136 152 In20Sn54Pb26
183 213 Sn90Pb10
183 215 Sn50Pb49Cu01
183 216 Sn50Pb50
183 216 Sn50Pb50Sb4
183 226 Sn45Pb55
183 238 Sn40Pb60
183 238 Sn40Pb60Sb4
183 246 Sn35Pb65

183 246 Sn35Pb65Sb4
183 254 Sn30Pb70
183 254 Sn30Pb70Sb4
183 277 Sn20Pb80
183 277 Sn20Pb80Sb4
184 270 Sn20Pb79Sb01
185 231 Sn40Pb58Sb02
185 243 Sn35Pb63Sb02
185 250 Sn30Pb68Sb02
185 263 Sn25Pb74Sb01
190 197 Sn89Zn8Bi3
195 225 In40Pb60
196 206 Sn88In8Ag3.5Bi,5
199 ea Sn91Zn9
___________
2
 Footnotes to Table B.4 appear at the end of the table.

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61190-1-3 Amend.1 © IEC:2010 – 7 –


Temperature
Alloy
°C
name

Solidus Liquidus

210 216 Sn92In4Ag3.5Bi,5

213 218 Sn96Ag2,5Bi1Cu,5

217 218 Sn95,8Ag3,5Cu,7
217 220 Sn96,5Ag3Cu,5
217 224 Sn98.3Cu,7Ag1

217 226 Sn95,5Ag3,8Cu,7

217 227 Sn96Ag2,5Bi1Cu,5

217 229 Sn95,5Ag4Cu,5

217 227 Sn99Cu,7Ag,3

217 353 Sn95Cu4Ag1
217 380 Sn92Cu6Ag2
218 228 Sn98.97Cu,7Ag,3Ni,03
221 ea Sn96,5Ag3,5
221 224 Sn97Ag3
221 228 Sn96,3Ag3,7
221 240 Sn95Ag5
227 ea Sn99Cu.7
227 310 Sn97Cu3
232 mp Sn100
235 240 Sn95Sb5
238 253 In30 Pb70
250 264 In25Pb75
268 290 Sn10Pb88Ag02
270 280 In19Pb81
275 302 Sn10Pb90
280 ea Au80Sn20
280 284 Sn05Pb93Ag02
280 305 Sn08Pb92
296 301 Sn05Pb94Ag01
299 307 Sn02Pb96Sb02
300 310 In05Pb92Ag03
304 ea Ag03Pb97
304 380 Ag06Pb94
305 306 Sn03Pb95Ag02
308 312 Sn05Pb95
309 ea Sn01Pb98Ag01
314 320 Sn03Pb97
320 325 Sn02Pb98
356 ea Au88Ge12
363 ea Au97Si03

451 485 Au82In18
a
The solidus and liquidus temperature values are provided for information only and are not intended to be a
requirement in the formulation of the alloys.
b
In the liquidus columns, “ea” indicates eutectic alloys and “mp” indicates the tabulated solidus temperature
representing the melting point for the elements (In99A and Sn99A). Although efforts have been made to document
the correct solidus and liquidus temperatures for each alloy, users of this standard are advised to verify these
temperature values before use.

---------------------- Page: 9 ----------------------
– 8 – 61190-1-3 Amend.1 © IEC:2010


After Annex B, add the following new Annex C:

Annex C

(informative)




Marking method of solder designation for mounted board,

used in electronic equipment




C.1 General

This annex provides the method for the indication of solder alloy(s) in mounted boards used in
electrical and electronic equipment.
C.2 Marking
C.2.1 Recommendation for marking
Recommendations for marking are as follows.
a) Robustness of the marking
Marking should not degrade over the intended use of the product.
b) Size
Marking should be easily recognizable and legible, either by unaided or correct
...