Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosures

IEC 61837-3:2015 deals with standard outlines and terminal lead connections as they apply to SMDs for frequency control and selection in metal enclosures and is based on IEC 61240 which standardized layout rules of outline drawings of the surface-mounted devices. This edition includes the following significant technical changes with respect to the previous edition: - The outline drawing is defined as one set of drawings consisting of four views, which are the view from above, the front view, the view from the right, and the view from below; the view from the right was drawn optionally in the previous edition. - The height of package (G1) is eliminated, instead total height is expressed by the symbol letter G or with a subscript number. - The dimensions of terminal lead spacing are shown by the centre position of the terminal leads and its basic value e is 2.54 x n mm (n is an integer) and 1,27 x n mm for package dimensions smaller than 6 mm (See IEC 61240:2012, 5.5). If the terminal lead spacing is not a multiple of the basic value, a subscript number such as e1, e2 is attached, e.g. e1, e2, etc. If there are plural spacing values, the subscript number is followed by a hyphen and numbers such as e1-1, e1-2 , etc. - In terminal land areas, the lengths of each terminal pad are now expressed with maximum values for consumer's convenience. They were expressed as minimum values in the previous edition of IEC 61837-3. - If there are plural identical enclosures with different height, each enclosure was expressed by a dash (/) and a two-digit number after the basic type name. The identity references are given in the table of the sheet. - The configurations of the enclosures were revised as shown in Table 1.

Oberflächenmontierbare piezoelektrische Bauteile zur Frequenzstabilisierung und -selektion - Norm-Gehäusemaße und Anschlüsse - Teil 3: Metallgehäuse

Dispositifs piézoélectriques à montage en surface pour la commande et le choix de la fréquence - Encombrements normalisés et connexions des sorties - Partie 3: Enveloppes métalliques

L'IEC 61837-3:2015 est applicable aux enveloppes métalliques normalisées et connexions des sorties des dispositifs à montage en surface pour la commande et le choix de la fréquence; elle est fondée sur l'IEC 61240, qui a normalisé les règles de tracé des dessins d'encombrement des dispositifs à montage en surface. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: - Le dessin d'encombrement est défini comme un ensemble de dessins composé de quatre vues, à savoir la vue de dessus, la vue de face, la vue de droite et la vue de dessous, la vue de droite ayant été dessinée en option dans l'édition précédente. - La hauteur du boîtier (G1) a été supprimée, la hauteur totale étant exprimée par la lettre-symbole G ou par un numéro en indice. - Les dimensions de l'espacement entre les sorties sont présentées par la position centrale des sorties et sa valeur de base e est de 2,54 x n mm (n étant un entier) et 1,27 x n mm pour des dimensions de boîtier inférieures à 6 mm (voir l'IEC 61240:2012, 5.5). Si l'espacement entre les sorties n'est pas un multiple de la valeur de base, un numéro d'indice tel que e1, e2 est associé, par exemple e1, e2, etc. En présence de plusieurs valeurs d'espacement, le numéro en indice est suivi d'un trait d'union et de numéros tels que e1-1, e1-2 , etc. - Dans les surfaces de contact des sorties, les longueurs de chaque plaquette de sortie sont désormais exprimées avec des valeurs maximales pour les besoins du client. Elles étaient exprimées en valeurs minimales dans l'édition précédente de l'IEC 61837-3. - En présence de plusieurs enveloppes identiques de hauteur différente, chacune d'elles était exprimée par une barre oblique (/) et un numéro à deux chiffres placé après le nom de type de base. Les références d'identité sont données dans le tableau de la feuille. - Les configurations des enveloppes ont été révisées comme indiqué au Tableau 1.

Površinsko nameščeni piezoelektrični elementi za regulacijo frekvence in filtriranje - Standardni okrovi in žični priključki - 3. del: Kovinski okrov

Ta del standarda IEC 61837 obravnava standardne mere in priključne izvode, ki se uporabljajo pri površinsko nameščenih piezoelektričnih elementih (SMD) za regulacijo in izbiranje frekvence na kovinskih okrovih, in temelji na standardu IEC 61240, ki je standardiziral pravila za prikaz tehničnih risb površinsko montiranih naprav.

General Information

Status
Published
Publication Date
03-Dec-2015
Withdrawal Date
19-May-2018
Current Stage
6060 - Document made available - Publishing
Start Date
04-Dec-2015
Completion Date
04-Dec-2015

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Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61837-3:2016
01-marec-2016
1DGRPHãþD
SIST EN 61837-3:2001
3RYUãLQVNRQDPHãþHQLSLH]RHOHNWULþQLHOHPHQWL]DUHJXODFLMRIUHNYHQFHLQILOWULUDQMH
6WDQGDUGQLRNURYLLQåLþQLSULNOMXþNLGHO.RYLQVNLRNURY
Surface mounted piezoelectric devices for frequency control and selection - Standard
outlines and terminal lead connections - Part 3: Metal enclosure
Ta slovenski standard je istoveten z: EN 61837-3:2015
ICS:
31.140 3LH]RHOHNWULþQHLQ Piezoelectric and dielectric
GLHOHNWULþQHQDSUDYH devices
SIST EN 61837-3:2016 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61837-3:2016

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SIST EN 61837-3:2016


EUROPEAN STANDARD EN 61837-3

NORME EUROPÉENNE

EUROPÄISCHE NORM
December 2015
ICS 31.140 Supersedes EN 61837-3:2000
English Version
Surface mounted piezoelectric devices for frequency control and
selection - Standard outlines and terminal lead connections -
Part 3: Metal enclosures
(IEC 61837-3:2015)
Dispositifs piézoélectriques à montage en surface pour la Oberflächenmontierbare piezoelektrische Bauteile zur
commande et le choix de la fréquence - Encombrements Frequenzstabilisierung und -selektion - Norm-
normalisés et connexions des sorties - Partie 3: Enveloppes Gehäusemaße und Anschlüsse - Teil 3: Metallgehäuse
métalliques (IEC 61837-3:2015)
(IEC 61837-3:2015)
This European Standard was approved by CENELEC on 2015-05-20. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.



European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2015 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN 61837-3:2015 E

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SIST EN 61837-3:2016
EN 61837-3:2015 (E)
European foreword
The text of document 49/1118/FDIS, future edition 2 of IEC 61837-3, prepared by IEC/TC 49
"Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control,
selection and detection" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 61837-3:2015.

The following dates are fixed:
• latest date by which the document has (dop) 2016-06-04
to be implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2018-05-20
• latest date by which the national
standards conflicting with the
document have to be withdrawn

This document supersedes EN 61837-3:2000.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.

Endorsement notice
The text of the International Standard IEC 61837-3:2015 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60122-3:2010 NOTE  Harmonized as EN 60122-3:2010 (not modified).
IEC 60191-6:2009 NOTE  Harmonized as EN 60191-6:2009 (not modified).
IEC 60368-1:2000 NOTE  Harmonized as EN 60368-1:2000 (not modified).
A1:2004 A1:2004
IEC 60368-2-2:1996 NOTE  Harmonized as EN 60368-2-2:1999 (not modified).
IEC 60368-3:2010 NOTE  Harmonized as EN 60368-3:2010 (not modified).
IEC 60679-1:2007 NOTE  Harmonized as EN 60679-1:2007 (not modified).
IEC 60679-3:2012 NOTE  Harmonized as EN 60679-3:2013 (not modified).
IEC 60862-1:2003 NOTE  Harmonized as EN 60862-1:2003 (not modified).
IEC 60862-2:2012 NOTE  Harmonized as EN 60862-2:2
...

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