EN 61837-1:1999

SLOVENSKI STANDARD
SIST EN 61837-1:2002
01-september-2002
Surface mounted piezoelectric devices for frequency control and selection -
Standard outlines and terminal lead connections - Part 1: Plastic moulded
enclosure outlines (IEC 61837-1:1999)
Surface mounted piezoelectric devices for frequency control and selection - Standard
outlines and terminal lead connections -- Part 1: Plastic moulded enclosure outlines
Oberflächenmontierbare piezoelektrische Bauteile zur Frequenzstabilisierung und -
Selektion - Norm-Gehäusemaße und Anschlüsse -- Teil 1: Kunststoffgehäuse
Dispositifs piézoélectriques à montage en surface pour la commande et le choix de la
fréquence - Encombrements normalisés et connexions des sorties -- Partie 1:
Encombrements des enveloppes en plastique moulées
Ta slovenski standard je istoveten z: EN 61837-1:1999
ICS:
31.140 3LH]RHOHNWULþQHLQ Piezoelectric and dielectric
GLHOHNWULþQHQDSUDYH devices
SIST EN 61837-1:2002 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61837-1:2002

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SIST EN 61837-1:2002

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SIST EN 61837-1:2002

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SIST EN 61837-1:2002

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SIST EN 61837-1:2002

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SIST EN 61837-1:2002
NORME CEI
INTERNATIONALE IEC
61837-1
INTERNATIONAL
Première édition
STANDARD
First edition
1999-05
Dispositifs piézoélectriques à montage en surface
pour la commande et le choix de la fréquence –
Encombrements normalisés
et connexions des sorties –
Partie 1:
Encombrements des enveloppes
en plastique moulées
Surface mounted piezoelectric devices
for frequency control and selection –
Standard outlines and terminal lead connections –
Part 1:
Plastic moulded enclosure outlines
 IEC 1999 Droits de reproduction réservés  Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in
utilisée sous quelque forme que ce soit et par aucun procédé, any form or by any means, electronic or mechanical,
électronique ou mécanique, y compris la photo-copie et les including photocopying and microfilm, without permission in
microfilms, sans l'accord écrit de l'éditeur. writing from the publisher.
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Telefax: +41 22 919 0300 e-mail: inmail@iec.ch IEC web site http://www.iec.ch
CODE PRIX
Commission Electrotechnique Internationale
U
PRICE CODE
International Electrotechnical Commission
Pour prix, voir catalogue en vigueur
For price, see current catalogue

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SIST EN 61837-1:2002
61837-1 © IEC:1999 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
SURFACE MOUNTED PIEZOELECTRIC DEVICES
FOR FREQUENCY CONTROL AND SELECTION –
STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS –
Part 1: Plastic moulded enclosure outlines
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International Organization
for Standardization (ISO) in accordance with conditions determined by agreement between the two
organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical reports or guides and they are accepted by the National Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61837-1 has been prepared by IEC technical committee 49:
Piezoelectric and dielectric devices for frequency control and selection.
This International Standard shall be read in conjunction with IEC 61240.
The text of this standard is based on the following documents:
FDIS Report on voting
49/431/FDIS 49/438/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
Annex A is for information only.

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SIST EN 61837-1:2002
61837-1 © IEC:1999 – 5 –
IEC 61837 consists of the following parts under the general title: Surface mounted piezoelectric
devices for frequency control and selection – Standard outlines and terminal lead connections:
Part 1 Plastic moulded enclosure outlines;
1)
Part 2 Ceramic enclosure outlines ;
1)
Part 3 Metal enclosure outlines .
___________
1)
 To be published.

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SIST EN 61837-1:2002
61837-1 © IEC:1999 – 7 –
INTRODUCTION
The demand for surface-mounted devices (SMD) for frequency control and selection increases
every year and IEC 61240, has been prepared in response to this demand. It has been
necessary to prepare separate standards covering individual SMD outlines and terminal lead
connections based on the general rules in IEC 61240.
After several discussions on the matter within TC 49, a proposal was prepared covering 61
types of enclosure designs, which has been accepted and issued as a committee draft. There
is, however, a risk that these will not be widely used, as too many kinds of reformed types of
leaded crystal units have been issued.
After considerable discussion on this matter at the TC 49 meeting in Rotterdam, it has been
decided that the individual SMDs available should be separated into three parts depending on
the material used to fabricate the enclosure. The three parts are:
– moulded plastic enclosures which are dealt with in this standard;
– ceramic enclosures which will be dealt with in IEC 61837-2; and
– metal enclosures which will be dealt with in IEC 61837-3.

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SIST EN 61837-1:2002
61837-1 © IEC:1999 – 9 –
SURFACE MOUNTED PIEZOELECTRIC DEVICES
FOR FREQUENCY CONTROL AND SELECTION –
STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS –
Part 1: Plastic moulded enclosure outlines
1 Scope
This part of IEC 61837 deals with standard outlines and terminal lead connections as they
apply to SMDs for frequency control and selection in plastic moulded enclosures and is based
on IEC 61240.
2 Normative references
The following normative documents contain provisions which, through reference in this text,
constitute provisions of this part of IEC 61837. For dated references, subsequent amendments
to, or revisions of, any of these publications do not apply. However, parties to agreements
based on this part of IEC 61837 are encouraged to investigate the possibility of applying the
most recent editions of the normative documents indicated below. For undated references, the
latest edition of the normative document referred to applies. Members of IEC and ISO maintain
registers of currently valid International Standards.
IEC 61240:1994, Piezoelectric devices – Preparation of outline drawings of surface-mounted
devices (SMD) for frequency control and selection – General rules
3 Configuration of enclosures
These enclosures are made of plastic moulded materials with the terminal leads based on
Descriptive Designation System for Semiconductors – Devices Package.
The configuration symbols are shown as follows:
– DCC (dual chip carrier);
– QCC (quad chip carrier);
– SIP (single in-line package).
4 Designation of types
The designation of types is shown on the four parts as follows:
A BC DD′
A: Configuration symbol of enclosures:
– DCC (dual chip carrier);
– QCC (quad chip carrier);
– SIP (single in-line package).

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SIST EN 61837-1:2002
61837-1 © IEC:1999 – 11 –
B: Structure of terminal leads:
– L: leaded type;
– J: folded leads type.
C: Number of terminal leads
D: Serial number of two figures
5 Plastic moulded enclosure dimensions
The dimensions in this standard apply to all the completed SMD-devices for frequency control
and selection. Only those dimensions are given which meet the requirements of IEC 61240.
6 Lead connections
Recommendations for the lead connections of all completed SMD-devices for frequency control
and selection are given in the following individual sheets. Lead connections shall always be
given in the detail specification.
7 Plastic moulded enclosures
The following table sets out the designation of the plastic moulded enclosures as outlined in
the ensuing specification sheets.
Table 1 – Designation of plastic moulded enclosures
No. Type Sheet No. Description
1 DCC-J4/01 Sheet 1 Plastic, moulded, four folded leads SMD outline
2 DCC-J4/02 Sheet 2 Plastic, moulded, four folded leads SMD outline
3 DCC-J4/03 Sheet 3 Plastic, moulded, four folded leads SMD outline
4 DCC-J4/04 Sheet 4 Plastic, moulded, four folded leads SMD outline
5 DCC-J4/05 Sheet 5 Plastic, moulded, four folded leads SMD outline
6 DCC-J4/06 Sheet 6 Plastic, moulded, four folded leads SMD outline
7 DCC-J4/07 Sheet 7 Plastic, moulded, four folded leads SMD outline
8 DCC-J4/08 Sheet 8 Plastic, moulded, four folded leads SMD outline
9 SIP-L5/01 Sheet 9 Plastic, moulded, single in-line five leads SMD outline

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SIST EN 61837-1:2002
61837-1 © IEC:1999 – 15 –
Dimensions (mm)
Actual size Ref. Notes
Min. Nom. Max.
14,00
A
8,90
B
4,70
G
G 4,20
1
K 0,40 0,60
1
K 0,20 0,30
2
9,40 9,80
F
L 1,70 2,10
B
5,08
e
A
e 7,62
1
b 0,80
2
4 3
l 2,30
2
y 0,10
A 0,30
3
0,40 0,60
b
p
1,00 1,60
L
p
12
Terminal land areas
b
2
S
y S
e
e
Terminal configuration
K
1
K
2
L
p
IEC  566/99
Scale 2:1
Plastic, moulded, four folded leads SMD outline
...